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Indian Standard Details

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Basic Details
IS Number : IS/IEC 62137-4 : 2014
62137-4: 2014

IS Title [Eng-Hn] : Electronics assembly technology Part 4 Endurance test methods for solder joint of area array type package surface mount devices
No of Revision : 0
No of Amendments : 0
Technical Department : Electronics and Information Technology Department
Technical Committee : LITD 5 ( Semiconductor And Other Electronic Components And Devices )
Language : English

Classification Details
Group : Electronic and Telecom equipments, components and devices
Sub Group: Electronic components and devices
Sub Sub Group : Semiconductor devices - Integrated circuits
Aspects: Methods of tests
Certification:
Ministry :
Short Commom Man's Title:
Itchs: N/A
Degree of Equivalence: Identical under single numbering
Identical/Equivalent Standards:62137-4: 2014
Organisation :

Cross Referencing Details
Indian Standards Refered In IS IS/IEC 62137 : Part 4 : 2014 :
SNo IS Number Title Technical Committee
1
IS 9000 : Part 14 : Sec 1 to 3 : 1988 Basic environmental testing procedures for electronic and electrical items:Part 14 test n:change of temperature (First Revision) LITD 1
2
IS/IEC 60194 : 2015 Printed Board Design Manufacture and Assembly-Terms and Definitions LITD 5
International Standards Refered In IS/IEC 62137 : Part 4 : 2014 Standard contains no Cross Referenced International Standard.
IS/IEC 62137 : Part 4 : 2014 is Refered in following Indian Standards : Standard contains no Cross Referenced Indian Standard.