| IS Number : | IS/IEC 60068-2-58 : 2015 IEC 60068-2-58: 2015 |
|---|---|
| IS Title [Eng-Hn] : | Environmental testing Part 2 Tests Section 58 Test Td: Test methods for solderability resistance to dissolution of metallization and to soldering heat of surface mounting devicesSMD |
| No of Revision : | 0 |
| No of Amendments : | 0 |
| Technical Department : | Electronics and Information Technology Department |
| Technical Committee : | LITD 5 ( Semiconductor And Other Electronic Components And Devices ) |
| Language : | English |
| Group : | N/A |
|---|---|
| Sub Group: | N/A |
| Sub Sub Group : | N/A |
| Aspects: | |
| Itchs: | N/A |
| Degree of Equivalence: | N/A |
| Identical/Equivalent Standards: | N/A |
| Indian Standards Refered In IS IS/IEC 60068 : Part 2 : Sec 58 : 2015 : | Details could not be found. |
|---|---|
| International Standards Refered In IS/IEC 60068 : Part 2 : Sec 58 : 2015 | Standard contains no Cross Referenced International Standard. |
| IS/IEC 60068 : Part 2 : Sec 58 : 2015 is Refered in following Indian Standards : | Standard contains no Cross Referenced Indian Standard. |