Document Details |
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| Name of Department/Committee : | MTD 24 | ||||
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| Document Number : | MTD 24 ( 25739) | ||||
| Document Title [English] : | Metallic and Other Inorganic Coatings Electrodeposited Gold and Gold Alloy Coatings for Electrical Electronic and Engineering Purposes Specification and Test Methods | ||||
| Document Title [Hindi] : | धात्विक और अन्य अकार्बनिक लेपन - विद्युत, इलेक्ट्रॉनिक और इंजीनियरिंग प्रयोजन के लिए इलेक्ट्रोडेपोजिटेड स्वर्ण और स्वर्ण मिश्रधातु लेपन - विशिष्टि और परीक्षण की पद्धतियाँ | ||||
| Document Type : | Revision | ||||
| Language : | English | ||||
| Priority : | 3 | ||||
| ICS Code : | 25.220.40 | ||||
| Date of Project Approval : | 01-05-2024 | ||||
| Standards to be Revised : |
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| Standards to be Superseded : |
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Classification Details |
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| Group : | Metals, Alloys and Metal Products (including Steel Products) |
| Sub Group : | Anti-corrosion products |
| Sub Sub Group : | Code of Practice & Glossary on corrosion protection |
| Aspects : | Product Specification |
| Risk : | None |
| Certification : | Voluntary Registration |
| Short Commom Man's Title : | Electroplated coatings of gold for general engineering purposes |
| ITCHS Code : | UDC66921 |
| Ministry : |
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| Sustainable development Goals : | |
| Degree of Equivalence : | Identical under dual numbering |
| Identical/Equivalent Standards : | ISO 27874 : 2008 |
| Organization Type: | ISO |
| Sl.No. | Synosis Points | |
| 1 | The engineering uses of electrodeposited gold and gold alloy coatings have expanded with the growth of the electrical and electronic industries. Low voltages and currents, dry circuits and microwave frequencies require low-resistance interconnection systems, connectors and waveguides. Non-tarnishing, low-resistance gold coatings were the logical choice for connectors where the stability of contact surfaces was critical. The need to improve the wear resistance of gold coatings led to the development of new electroplating solutions containing controlled amounts of metallic and non-metallic additives that either changed the composition or altered the crystal structure of the coating. The special needs of the printed-circuit industry led to the development of acid gold electroplating solutions that contained no free cyanide, yielding coatings that are hard, bright and solderable. | |
| 2 | Formulations for high-speed electroplating up to current densities of 200 A/dm2 were introduced for continuous strip, stripe or spot gold and gold alloy coatings. The high cost of gold metal has led to the development of selective and thickness profile plating techniques to limit the use of the metal to the active areas only of the components, where the gold is required. Designers will therefore often specify the area requiring gold electroplating as well as the thickness profile, if required, by reference to suitably marked drawings. | |
| 3 | With the introduction of many new gold electroplating formulations and the proliferation of engineering applications, the need for technical standards that specify the requirements of electrodeposited gold and gold alloy coatings, as well as the test methods to ensure that the specified requirements are met, is critical. Composition, appearance, hardness, thickness, purity, porosity, wear resistance, solderability, electrical contact resistance, infrared reflectivity and other properties must be controlled to produce high-quality gold and gold alloy coatings for engineering purposes. | |
| 4 | WARNING — This International Standard may not be compliant with some countries’ health, safety and environmental legislations. It calls for the use of substances and/or procedures that may be injurious to health if adequate safety measures are not taken. This International Standard does not address any health hazards, safety or environmental matters, or legislation associated with its use. It is the responsibility of the user of this International Standard to establish appropriate health, safety and environmentally acceptable practices and take appropriate action to comply with any national, regional and/or international regulations. Compliance with this International Standard does not, of itself, confer immunity from legal obligations. | |
Timeline Details |
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Stages |
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| Sl. No. |
Stage | Date of Occurence | Remarks | Circulated to | Files |
| 1 | Generation of Document Number | 01-05-2024 | ------- | ||
| 2 | P-Draft Waived | 03-06-2024 | ISO Adoption. | ------- | |
| 3 | WC Draft | 03-06-2024 | Duration : 30 Days Submitted for HOD approval |
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| 4 | WC Draft | 03-06-2024 | WC rejected by HOD Remarks: kindly modify the dates |
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| 5 | WC Draft | 04-06-2024 | Duration : 30 Days Submitted for HOD approval |
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| 6 | WC Draft | 10-06-2024 | WC rejected by HOD Remarks: Kindly modify the dates |
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