Document Details |
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| Name of Department/Committee : | ETD 19 | ||||||
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| Document Number : | ETD 19 ( 23935) | ||||||
| Document Title [English] : | INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS Part 3: Use of Coating Potting or Molding for Protection against Pollution Second Revision | ||||||
| Document Title [Hindi] : | निम्न वोल्टता तंत्र में उपकरणों का विद्युतरोधी समन्वय भाग 3 प्रदुषण से सुरक्षा के लिए लेपन, पोटिंग या मोल्डिंग का प्रयोग (दूसरा पुनरीक्षण) | ||||||
| Document Type : | Revision | ||||||
| Language : | English | ||||||
| Priority : | 3 | ||||||
| ICS Code : | 29.080.30 | ||||||
| Date of Project Approval : | 04-10-2023 | ||||||
| Standards to be Revised : |
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| Standards to be Superseded : |
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Classification Details |
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| Group : | Electrical Switchgear and Other Electrical Products/Accessories |
| Sub Group : | Electrical installations and general electricals |
| Sub Sub Group : | National Electrical Code |
| Aspects : | Code of Practice |
| Risk : | Medium |
| Certification : | Not Certifiable |
| Short Commom Man's Title : | |
| ITCHS Code : | |
| Ministry : |
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| Sustainable development Goals : |
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| Degree of Equivalence : | Identical under dual numbering |
| Identical/Equivalent Standards : | IEC 60664-3:2016 |
| Organization Type: | IEC |
::Cross Referenced Indian Standard:: |
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| Sl. No. | Is No & Year | IS Title | |
| 1 | IS/IEC 60068 : Part 2 : Sec 2: 2007 | Environmental Testing Part 2: Tests - Test B Section 2: Dry Heat | |
| 2 | IS/IEC 60068 : Part 2 : Sec 14: 2009 | Environmental testing Part 2: Tests Section 14: Test N: Change of temperature | |
| Sl.No. | Synosis Points | |
| 1 | This standard applies to assemblies protected against pollution by the use of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in IS/IEC 60664-1. This document describes the requirements and test procedures for two methods of protection: – Type 1 protection improves the microenvironment of the parts under the protection; Type 2 protection is considered to be similar to solid insulation. This document also applies to all kinds of protected printed boards, including the surface of inner layers of multi-layer boards, substrates and similarly protected assemblies. In the case of multi-layer printed boards, the distances through an inner layer are covered by the requirements for solid insulation in IS/IEC 60664-1. | |
Timeline Details |
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Stages |
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| Sl. No. |
Stage | Date of Occurence | Remarks | Circulated to | Files |
| 1 | Generation of Document Number | 04-10-2023 | ------- | ||
| 2 | P-Draft Waived | 23-10-2023 | ------- | ||
| 3 | WC Draft | 23-10-2023 | Duration : 60 Days Submitted for HOD approval |
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| 4 | WC Draft | 23-10-2023 | WC approved by HOD |
ETDC ETD 19, | ------- |
| 5 | Skipped to Finalization | 21-07-2024 | Stage-Changed | ------- | |
| 6 | Finalization | 09-05-2024 | High Voltage Engineering Sectional Committee ETD 19 during its 25th meeting held on 09th May 2024 approved the document for printing | ------- | |
| 7 | Final Draft | 21-07-2024 | Submited for HOD approval Remarks: High Voltage Engineering Sectional Committee ETD 19 during its 25th meeting held on 09th May 2024 approved the document for printing |
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| 8 | Final Draft draft accepted by HOD and sent to Publication | 22-07-2024 | Final Draft approved by HOD | ------- | |