History
Document Details
Name of Department/Committee : LITD 05
Document Number : LITD 05 ( 16612)
Document Title [English] : Printed Circuit Board Assembly Part 1 Safety Requirements
Document Title [Hindi] : मुद्रित परिपथ बोर्ड ऐसेम्बली भाग 1 -सुरक्षा आवश्यकताएँ
Document Type : New
Language : English
Priority : 3
ICS Code : 31.190 31.180
Date of Project Approval : 19-11-2020
Standards to be Superseded :

Classification Details
Group : Electronic and Telecom equipments, components and devices
Sub Group : Electronic components and devices
Sub Sub Group : Semiconductor devices - Integrated circuits
Aspects : Product Specification
Risk : Low
Certification : Voluntary Registration
Short Commom Man's Title :
ITCHS Code :
Ministry :
  • Ministry of Electronics and Information Technology
Sustainable development Goals :
  • INDUSTRY, INNOVATION AND INFRASTRUCTURE
Degree of Equivalence : Indigenous
Identical/Equivalent Standards :
Organization Type:
::Cross Referenced Indian Standard::
Sl. No. Is No & Year IS Title
1 IS/IEC 60194 : 2015 Printed Board Design Manufacture and Assembly-Terms and Definitions
Sl. No. Document No Document Title
1 LITD/05 / 16663 Test methods for electrical materials interconnection structures and assemblies Part 1 General test methods and methodology
2 LITD/05 / 16671 Test methods for electrical materials interconnection structures and assemblies Part 5 Test methods for printed board assemblies
3 LITD/05 / 16954 Environmental testing Part 2 Tests Section 58 Test Td: Test methods for solderability resistance to dissolution of metallization and to soldering heat of surface mounting devicesSMD
4 LITD/05 / 16955 Environmental testing Part 2 Tests Section 69 Test TeTc: Solderability testing of electronic components and printed boards by the wetting balance force measurement method
5 LITD/05 / 16956 Environmental testing Part 2 Tests Section 82 Test Xw1: Whisker test methods for components and parts used in electronic assemblies
6 LITD/05 / 16957 Environmental testing Part 2 Tests Section 83 Test Tf: Solderability testing of electronic components for surface mounting devices SMD by the wetting balance method using solder paste
7 LITD/05 / 16958 Electronics assembly technology Part 4 Endurance test methods for solder joint of area array type package surface mount devices
8 LITD/05 / 18103 Environmental testing Part 2 Tests Section 20 Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Sl.No. Synosis Points
1 This standard (Part 1) provides specific safety requirements for Printed Circuits Board Assemblies (PCBA).
Timeline Details


S.No. P-Draft
Completion Date		 WC-Draft
Completion Date		 Final-Draft
Completion Date		 Project
Completion Date(Gazette)		 Entered By Entered On
1 24-05-2021 17-12-2021 02-05-2022 02-12-2022 Mr. BIPIN JAMBHOLKAR 10-05-2021
Stages
Sl.
No.		 Stage Date of Occurence Remarks Circulated to Files
1 Generation of Document Number 19-11-2020 -------
2 P-Draft 16-04-2021 Covering letter generated -------
3 P-Draft 16-04-2021 Duration : 30 Days LITD 5, -------
4 Skipped to W-Draft 12-07-2021 Stage-Changed -------
5 WC Draft 14-10-2021 Duration : 60 Days
Submitted for HOD approval
Remarks : The object of this standard is to lay down the specific safety requirements for Printed Circuit Board Assemblies PCBA 		-------
6 WC Draft 24-11-2021 WC approved by HOD
 LITDC   -------